Core Specifications

Model: XTT-PDB-516000-V10

Max Power: 16,000W (5 3200W CRPS modules)

Dimensions: 426.00 mm (L) 125.00 mm (W) 2.50 mm (H)

Redundancy: Parallel operation of 1 C5 modules; excess units auto-activate as backups.

Key Interfaces:

31 CPU 8PIN MINI FIT 2×4 (Point A)

5 Dtype Big 4PIN (Point B)

MINI FIT 2×5 + 2×9 ATX 24PIN (Point C)

5 CRPS Power Connectors (Point D)

PMbus + I2C BMC (Points E & F)

Power Architecture & Reliability

16,000W Scalability:

Deploys 1 C5 CRPS modules in parallel, dynamically scaling power for GPU-dense AI servers or storage arrays.

Hot-swappable modules enable replacements without system shutdown, critical for 24/7 data centers.

True N+1 Redundancy:

Unused modules automatically provide backup if active units fail or exceed load thresholds.

All modules share load evenly, eliminating single points of failure.

Interface Capabilities

1.GPU/CPU Power Hub (Point A):

Direct motherboard CPU 8PIN connections.

GPU 8PIN (6+2) or 12VHPWR via adapters (e.g., NVIDIA RTX 40-series/AMD RDNA 3).

31 8PIN ports support:

Enables simultaneous power delivery to 8+ high-end GPUs in AI training rigs.

2.Storage & Motherboard Integration:

Dtype Big 4PIN (Point B): Powers HDD/SSD backplanes for large-scale storage systems.

ATX 24PIN Conversion (Point C): Compatible with standard server motherboards.

3.Monitoring & Management:

PMbus (Point E): Tracks real-time power/temperature via BMC (requires motherboard support).

I2C BMC (Point F): Enhances system-level control for predictive maintenance.

Connection Methods

CPU 8PIN Ports: Use adapters for:

CPU 8PIN Motherboard

CPU 8PIN GPU 6+2PIN/12VHPWR

Dtype 4PIN: Direct link to storage backplanes.

CRPS Modules: Plug-and-play installation.

Visual guide for recommended wiring:

Technical Highlights

1.Future-Proof GPU Support:

Native 12VHPWR compatibility for next-gen GPUs, reducing cable clutter vs. traditional 8PIN solutions.

2.Energy Intelligence:

PMbus + I2C BMC provides granular power analytics, optimizing efficiency in hyperscale deployments.

3.Maintenance Efficiency:

Tool-free module swaps cut downtime by 40%; parallel design simplifies capacity upgrades.

4.Enterprise Resilience:

8-layer PCB ensures signal integrity under 16kW load; all modules operate concurrently without throttling.

Target Applications

AI/ML training servers with multi-GPU configurations

High-availability data center racks

Edge computing and hyperscale storage

Financial modeling or scientific simulation clusters

Ordering Information
Elevate your power infrastructure with the XTT-PDB-516000-V10 where 16,000W scalability meets bulletproof redundancy. Contact sales for OEM customization or bulk pricing.